11 November 2021 | Thursday | News
OMRON Corporation based in Kyoto, Japan, has announced the development of a new VT-X750-V3 system, the world's fastest (*1) CT-type X-ray inspection device (*2) to date, and said it will be released globally on November 20. The VT-X750-V3 delivers advanced, true 3D inspection of electronic substrates to meet the growing needs of fifth-generation mobile communication systems (5G), electric vehicles (EVs), and autonomous driving application products. OMRON contributes to the security and safety of society through high-speed, PCB design constraint-free, 100% X-ray inspection of electronic substrate assemblies to maintain and improve productivity while simultaneously ensuring the quality of customer products.
Realizing even faster, high-quality, CT-type X-ray automated inspection with VT-X750-V3: https://kyodonewsprwire.jp/img/202111052966-O6-OLtVm6x2
In recent years, demand for electronic substrates to support 5G, EVs, and autonomous driving applications has grown rapidly, which in turn continues to raise the quality requirements of these substrates. These advanced applications may involve risks to human life and the highest-quality inspection is necessary to ensure the reliability, performance and safety of the final products. Design, manufacturing and inspection challenges are growing such as progressing PCBA densification through IC chipping, which relates to parts mounting on both sides of the board and further consolidation of parts to increase the number of components mounted on the board. To inspect these components with true accuracy and stability, traditional 2D X-ray imaging techniques are insufficient or incapable and 3D inspection has become essential. However, 3D X-ray imaging, image processing and inspection take time. It is very difficult to achieve both operating effectiveness and high-quality inspection. Historically, in order to keep pace with antiquated 2D X-ray cycle-times or meet production demands, 3D CT inspection may have only been used on a portion of the assembly, for the most critical components or in an offline inspection cell away from the production line to meet 100% inspection requirements.
Comparing X-ray technology imaging of solder defects: traditional 2D-2.5D (left) and true 3D CT (right): https://kyodonewsprwire.jp/prwfile/release/M102197/202111052966/_prw_PI1fl_RV565X3o.png
The VT-X750-V3 delivers an inspection speed 1.5 times faster than the current model, making 100% CT X-ray inspection of even complex substrates more achievable than ever. High-speed acquisition of clear 3D images has been actualized with unique, continuous imaging technology (*3) and seamless, smooth motion through OMRON's own machine control equipment and a camera with two times (*4) the sensitivity of conventional technology. This allows for high-performance inspection within a shorter cycle time. In addition, the CT imaging condition settings used for inspection are more automated through ongoing OMRON AI development in order to further reduce program-tuning time. OMRON's expertise, experience and continuous innovation have been helping to improve customer productivity for more than 30 years.
Today's more complex substrates/components require 3D CT AXI: https://kyodonewsprwire.jp/img/202111052966-O2-1k04Q1rT
OMRON's strategic concept of "innovative-Automation" consists of the three i's: "integrated (the evolution of control)," "intelligent (intelligence developed through IoT and AI)," and "interactive (new harmonization between humans and machines)." OMRON is driving innovations on the production floor. By combining the integration of the widest range of control devices and the use of AI fully versed in solder inspection, the VT-X750-V3 is the latest offering from OMRON that embodies the "innovative-Automation" concept. OMRON offers total solutions designed to achieve zero-defect production lines.
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